Influence of debinding and sintering conditions on the composition and thermal conductivity of copper parts printed from highly loaded photocurable formulations

Abstract Metal 3D printing based on the photopolymerization reaction (Digital Light Processing—DLP) of an organic matrix in which metal particles are embedded is a developing technology. This technology requires step resin removal and densification by sintering to obtain part. process has been applied copper. Photocurable formulations with high loading rate copper powder 60 vol.% were developed suitable for DLP thicknesses > 25 µm. Debinding cycles investigated specimens fast cured gamma irradiation save materials time. A debinding air at 400 °C hydrogen lead C content 0.018 wt.%, similar raw slightly higher oxygen content. The low thermal conductivity 250 W·m −1 ·K highlighted harmful effect phosphorus from photoinitiators such as BAPO. O contents measured parts printed confirm results obtained irradiation.